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AMS 2690
Parallel Gap Welding Microelectronic Interconnections to Thin Film Substrates
Parallel Gap Welding Microelectronic Interconnections to Thin Film Substrates
2011-10-01
有效
【范围】 1.1 Purpose: This specification defines the equipment, procedures, and requirements for joining leads by parallel gap resistance welding. 1.2 Application: For attaching leads by parallel gap resistance welding in the assembly of micro-electronic circuitry to thin film substrates.strRefField
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替代标准

引用文件/被引文件

Standards and Test Methods
Parts and Equipment
Welding Terms and Definitions

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