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【范围】
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1.1 Form:
This specification and its supplementary detail specifications cover boron filaments in the form of
tape impregnated with epoxy resin, the resin to be supplied in a “B” stage condition.
1.2 Application:
Primarily for fabricating high-strength and high-modulus composite parts, with either hand-layup or
automated-tape-layup.
1.3 Classification:
The tapes shall be as specified in the applicable detail specification, wherein each product is defined
by filament nominal diameter, resin system, and continuous service temperature. An example is
shown in 8.2. The tape covered by each detail specification appears as part of the title.
1.4 Safety - Hazardous Materials:
While the materials, methods, applications, and processes described or referenced in this
specification may involve the use of hazardous materials, this specification does not address the
hazards which may be involved in such use. It is the sole responsibility of the user to ensure
familiarity with the safe and proper use of any hazardous materials and to take necessary
precautionary measures to ensure the health and safety of all personnel involved.strRefField
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